Ma ke ʻano he mea hana loea i loea i kanā papa alumini, nā koʻokoʻo, nā paipu a me nā lawelawe mīkini kikoʻī, ke hōʻike haʻaheo nei mākou i kā mākou huahana alumini 5083 hana kiʻekiʻe i hana kūikawā ʻia no ka ʻoihana semiconductor honua. ʻO ka alumini 5083, kahi Al-Mg alloy hiki ke mālama ʻia me ka wela ʻole, kū i waho o kekahi o nā mea hana kūkulu i hoʻohana nui ʻia i nā lako hana semiconductor, nā ʻōnaehana hana wafer a me nā ʻāpana lumi maʻemaʻe, ma muli o kona paʻa mechanical kūikawā, ke kūpaʻa ʻana i ka corrosion ultra-stable, ka hoʻohālikelike vacuum kiʻekiʻe a me ka mīkini maʻalahi. Hana ʻia e hoʻokō i nā kūlana SEMI a me nā koi lumi maʻemaʻe koʻikoʻi, hāʻawi kā mākou alumini 5083 i ka hana i kūlike ʻole no nā noi semiconductor koʻikoʻi kahi e hiki ʻole ai ke kūkākūkā i ka maʻemaʻe o nā mea, ke kūpaʻa dimensional a me ka hilinaʻi lōʻihi.

1. Ka Hoʻohui Kemika a me ka Maʻemaʻe o nā Mea (Pae Semiconductor)

Hana ʻia kā mākou alumini semiconductor-specific 5083 ma lalo o nā kaohi metallurgical paʻa e hōʻoia i nā pae haumia haʻahaʻa loa, e kūlike ana me nā pae hoʻohālikelike maʻemaʻe kiʻekiʻe loa no nā mea uila.

- Alumini (Al): Kaulike (≥93.5%)

- Makenesium (Mg): 4.0% – 4.9% (mea hoʻoikaika mua)

- Manganese (Mn): 0.4% – 1.0% (hoʻomaikaʻi i ka hoʻomaʻemaʻe ʻana i ka palaoa a me ka hoʻoikaika ʻana i ke kūpaʻa ʻana i ka palaho)

- Chromium (Cr): 0.05% – 0.25% (kāohi ʻana i ka palaho intergranular)

- Nā kaha (Si, Fe, Cu, Zn, Ti): Kāohi pono ʻia ≤0.2% o ka huina, me ka ʻole o nā metala kaumaha ʻino

Hoʻopau kēia ʻano kemika i hoʻoponopono pono ʻia i nā hemahema kūloko, hoʻemi i nā pilikia outgassing ma lalo o nā kūlana vacuum ultra high (UHV) a hōʻoia i ke kūpaʻa kūikawā i nā kemika corrosive i hoʻohana pinepine ʻia i ka semiconductor etching, hoʻomaʻemaʻe a me nā kaʻina hana deposition. ʻAʻole e like me ka maʻamau ʻoihana 5083, ʻo kā mākou ʻano semiconductor-grade e hana ʻia i ka triple refining a me ka homogenization heat treatment, e hoʻokō ana i kahi microstructure homogenous me ka ʻole o nā inclusions non metallic, koʻikoʻi no ka mālama ʻana i ka pololei o ka pae submicron i nā ʻāpana semiconductor waiwai nui.

2.Nā Waiwai Mekanika a me ke Kino Koʻikoʻi (Hoʻonohonoho ʻia no nā Kaiapuni Semiconductor)

Hāʻawi ka alumini 5083 i kahi kaulike kūpono ʻole o ka ikaika, ka ductility a me ke kūpaʻa, e kūpono ana no ka halihali ukana a me nā ʻāpana kikoʻī i nā lako semiconductor.

- Ikaika Tensile (H112/H321 Temper): 270 – 340 MPa

- Ikaika Hua (0.2% Offset): 120 - 215 MPa

- Elongation: 12% – 20% (kūpono ke hoʻohālikelike maikaʻi loa no ka mīkini paʻakikī)

- Ka nui o ka paʻa: 2.66 g/cm³ (māmā, e hōʻemi ana i ka inertia o nā lako a me ka hoʻohana ʻana i ka ikehu)

- Ka Hoʻokele Wela: 120 W/m·°C (ka hoʻopuehu wela kūpono no nā kaʻina hana hoʻopōʻaiapuni wela)

- Ka helu o ka hoʻonui wela: 24.2 × 10⁻⁶/°C (kūpaʻa dimensional i wānana ʻia ma lalo o nā loli o ka mahana)

- Ka Hoʻokele Uila: 29% IACS (kūpono no nā ʻāpana i kāohi ʻia e ka hoʻokuʻu electrostatic (ESD))

- Paʻakikī (HV): 75 - 90 (kū'ē i ka ʻaʻahu a me ka deformation i nā ʻōnaehana lawelawe alapine kiʻekiʻe)

ʻO kahi pōmaikaʻi koʻikoʻi o ka alumini 5083 ʻo ia kona paʻa ʻana o ka ikaika ma hope o ka hoʻopili ʻana (≥90% o ka ikaika o nā mea kumu), e hoʻopau ana i nā nāwaliwali o ke ʻano i loko o nā keʻena semiconductor i hoʻopili ʻia a me nā ʻākoakoa paipu. Eia kekahi, hōʻike ia i ka hana cryogenic koʻikoʻi: ma -196°C (mahana naikokene wai), piʻi ka ikaika tensile ma 30%–50% me ka mālama ʻana i ka paʻakikī kiʻekiʻe, e kūpono ana no nā lako hana semiconductor haʻahaʻa.

3. Nā Pōmaikaʻi Koʻikoʻi no nā Noi Semiconductor

- Kū'ē i ka ʻino kiʻekiʻe loa a me ka hoʻohālikelike ʻana me ka lumi maʻemaʻe

ʻO ka nui o ka magnesium o ka alumini 5083 e hāʻawi i ke kūpaʻa kūikawā i nā kemika ʻoihana, nā mea hoʻomaʻemaʻe alkaline, nā etchants plasma a me ka makū, maʻamau i nā lumi maʻemaʻe semiconductor. Hoʻokumu ia i kahi papa oxide mānoanoa a pale i ka manawa kūʻokoʻa, e pale ana i ka hōʻino ʻana o nā mea a me ka haumia o nā ʻāpana. Hana ʻia kā mākou huahana i ka mālama passivation ponoʻī e hoʻomaikaʻi hou i ke kūpaʻa o ka ʻili, e hōʻoiaʻiʻo ana i ka haumia ʻole o ka ion a me ka hoʻokō ʻana me nā kūlana outgassing SEMI F72 no nā ʻōnaehana UHV.

- Paʻa Ana a me ka Maʻalahi o ka Hana ʻana

Me ka liʻiliʻi o ke koʻikoʻi koena a me ke ʻano like ʻole o ka microstructural, ua hoʻomaha ʻia kā mākou pilikiaMālama ka alumini 5083 (H112/H321 temper)nā hoʻomanawanui paʻa (± 0.01mm) ma hope o ka mīkini CNC paʻakikī, ka ʻoki laser a me ka ʻeli hohonu ʻana i ka lua. Kākoʻo ia i nā hoʻopau ʻili laumania loa (Ra ≤ 0.8μm) ma o ka electropolishing a me ka wili pololei, koʻikoʻi no ka hōʻemi ʻana i ka hoʻopili ʻana o nā ʻāpana i loko o nā keʻena vacuum a me nā mea lawe wafer. Hōʻoia kēia kūpaʻa i ka hana mau ma luna o nā tausani o nā pōʻaiapuni thermal a me nā hana mechanical.

- Ka Weldability Kiʻekiʻe a me ka Pono Kūkulu

Ma ke ʻano he mea hoʻohuihui alumini ikaika loa hiki ʻole ke hoʻomehana ʻia, hiki i ka 5083 ke hoʻopilikino ikaika a ʻaʻohe hemahema ma o ka TIG, MIG a me ka hoʻopilikino laser me ka ʻole o ka pohō nui o ka ikaika. ʻAe kēia i ka hana maʻalahi o nā kino keʻena semiconductor nui, nā paipu hoʻolaha kinoea a me nā kiʻikuhi kūkulu maʻamau, e hoʻopau ana i nā ala leak a me ka hōʻoia ʻana i nā helu leak helium <10⁻⁹ mbar·L/s, he mea nui no ka pono o UHV.

- Hilinaʻi Lōʻihi a me ka Pono o ke Kumukūʻai

Kūʻē ka alumini 5083 i ka hāʻule ʻana o ka luhi ma lalo o ke kaumaha mechanical cyclic a me ka haʻalulu wela, e hāʻawi ana i nā makahiki he ʻumi o ka lawelawe hilinaʻi i nā wahi hana semiconductor 24/7. ʻO kona ʻano māmā e hōʻemi ana i ke kaumaha o nā lako me ka ʻole o ka mōhai ʻana i ka hiki ke ukana, e hoʻohaʻahaʻa ana i nā kumukūʻai halihali, hoʻokomo a me nā hana. I hui pū ʻia me kā mākou mau hiki ke hana mīkini pololei, hoʻemi ia i ka ʻōpala mea a hoʻopōkole i nā manawa alakaʻi hana.

4. Nā noi ʻoihana Semiconductor

ʻO kā mākou mau papa alumini 5083, nā koʻokoʻo, nā paipu a me nā ʻāpana mīkini i hana ʻia e hana maʻamau i nā pae hana semiconductor koʻikoʻi:

- Nā Lako Hana Wafer: Nā ʻano keʻena, nā papa electrode, nā manifolds hoʻolaha kinoea, nā mōlina lawe wafer, a me nā lima robot

- Nā ʻōnaehana kālai ʻana a me ka waiho ʻana: Nā ʻāpana keʻena hakahaka, nā apo pale, nā nozzles kinoea, a me nā papa hoʻoluʻu

- Nā ʻōnaehana lumi maʻemaʻe a me ka lawelawe ʻana: Nā mea paʻa pololei, nā alakaʻi neʻe laina, nā paipu kemika, a me nā kahawai pono

- Nā Lako Hoʻāʻo a me ka Nānā: Nā kumu paʻa dimensional, nā ʻāpana kikowaena probe, a me nā mauna optical

- Nā ʻĀpana Kūikawā: Nā pale Cryogenic, nā hale pale i ka pala, a me nā ʻāpana kūkulu palekana ESD

5. ʻO kā mākou hana ʻana a me ka hōʻoia maikaʻi

Hāʻawi mākou i nā hoʻonā alumini spectrum piha 5083 e pili ana i nā papa hoʻopau wili (mānoanoa 0.5mm a 400mm), nā koʻokoʻo extruded (diameter 3mm a 300mm), nā paipu seamless (OD 5mm a 200mm) a me nā ʻāpana mīkini CNC maʻamau, i hana ʻia ma lalo o ISO 9001 a me nā ʻōnaehana hoʻokele maikaʻi semiconductor.

- Ka Hiki ke Hahai ʻia o nā Mea: Nā hōʻike hoʻāʻo piha o ka wili (MTR) no kēlā me kēia pūʻulu, e hōʻoiaʻiʻo ana i ka hiki ke hahai piha ʻia mai ka ingot a i ka ʻāpana i pau

- Ka Hana ʻana i ka Lumi Maʻemaʻe: Nā ʻāpana koʻikoʻi i hana ʻia ma nā lumi maʻemaʻe Papa 1000 e pale aku i ka haumia o nā ʻāpana liʻiliʻi

- Hoʻāʻo Pololei: 100% hoʻāʻo ultrasonic (UT), hoʻāʻo eddy current (ECT) a me ka nānā ʻana o ka dimensional

- Hoʻopilikino: Nā ʻano hoʻomehana i hana ʻia, nā hana ʻili (electropolishing, anodizing, passivation) a me ka mīkini paʻa-hoʻomanawanui e like me nā kiʻi a ka mea kūʻai aku

No nā mea hana semiconductor e koi ana i nā mea e hoʻohui i ka ikaika kūkulu, ka inertness kemika, ka pololei dimensional a me ka pono o ke kumukūʻai, kā mākou semiconductor-grade5083 alumini metalaʻO ke koho kūpono loa ia. Me ke kākoʻo ʻia e ko mākou akamai i ka hana ʻana i ka alumini a me ka mīkini kikoʻī, hāʻawi mākou i nā huahana maʻemaʻe kiʻekiʻe, kūlike nā huahana e hoʻomaikaʻi i ka hana o nā lako, hoʻolōʻihi i ke ola lawelawe a hōʻemi i ke kumukūʻai o ka loaʻa ʻana o nā lako. Inā makemake ʻoe i nā ʻano alumini maʻamau a i ʻole nā ​​​​ʻāpana maʻamau i hoʻopau piha ʻia, hāʻawi mākou i nā hoʻonā hopena-a-hope i hana ʻia e ʻoi aku ma mua o nā kūlana ʻoihana semiconductor paʻakikī loa. E hui pū me mākou e hoʻokiʻekiʻe i kāu lako semiconductor me ka maikaʻi o nā mea e hoʻokele ai i ka huahana a me ka hilinaʻi i ka hana ʻana o nā chip holomua.