Ukufuna ngokungapheliyo kweshishini le-semiconductor lee-chips ezincinci, ezikhawulezayo, nezinamandla ngakumbi kuye kwatyhala iinkqubo zokuvelisa kumanqanaba angaqhelekanga okuchaneka, kwaye akukho ndawo apho olu xinzelelo lunzima khona kunakwimigca yokucoca ye-semiconductor. Ezi nkqubo zibalulekileyo zinoxanduva lokususa ungcoliseko kwinqanaba le-athomu, njengoko nesuntswana elinye elinobukhulu be-micron okanye i-trace metal ion inokwenza i-chip ye-3nm ingasebenzi. Kangangeminyaka, eli shishini belixhomekeke kuluhlu oluncinci lwezinto, licinga ukuba ukusebenza kufuna ukuncama nokuba yindleko, ubunzima, okanye ukuqina. Kodwa i-aluminium echanekileyo kunye nee-alloys zayo, kuquka neyenziwe ngokwezifiso.iipleyiti ze-aluminium, iibha ze-aluminium,kunye neetyhubhu ze-aluminium, ziye zavela njengezinto ezitshintsha umdlalo, zidlula ulindelo kwaye zibaluleke kakhulu kwimigca yokucoca esebenza kakhulu. Eli libali lendlela i-aluminium, ngokusebenzisa ubuchwepheshe obuphambili kunye nesayensi yezinto eziphathekayo, eye yakhula ngayo yaba lilitye lesiseko lokugqwesa kokwenziwa kwe-semiconductor.

Imigca yokucoca i-semiconductor iquka uluhlu lweenkqubo, ukusuka ekutshiseni nasekuhlambululeni iikhemikhali ezimanzi ukuya ekucoceni i-plasma eyomileyo, nganye ineemfuno zezinto ezizodwa. Iibhentshi ezimanzi, ezisebenzisa izisombululo zeekhemikhali ezinamandla ukususa ii-oxides kunye nongcoliseko lwesinyithi, zifuna izinto ezimelana nokugqwala, zinciphise ukuchitheka kwamasuntswana, kwaye zixhase ukuhamba kolwelo ngokuchanekileyo. Iinkqubo zokucoca i-vacuum plasma, kwelinye icala, zifuna ukuhambelana kwe-UHV, uzinzo lobushushu, kunye nokuchasana nokukhukuliseka okubangelwa yi-plasma. Kangangamashumi eminyaka, ezi mfuno zikhokelele abavelisi ukuba bathande izixhobo ezifana ne-316L stainless steel kwiinkqubo ezimanzi kunye ne-quartz yamagumbi e-plasma, ukhetho oluza ne-tradeoffs ebalulekileyo. Iinkqubo zokuphatha ezenzekelayo ze-stainless steel ezinobunzima obuphezulu, ngelixa i-thermal conductivity yayo embi ibangele i-gradients yobushushu eyanciphisa ukufana kokucoca. I-Quartz, nangona ingasebenzi ngokweekhemikhali, ibuthathaka kwaye ibiza kakhulu, ikhokelela kwiindleko eziphezulu zokutshintsha kwiindawo zemveliso eziphezulu.

Ukunyuka kwe-aluminium kwaqala ngokuqaphela ukuba iipropati zayo, ukukhanya okulula, ukuqhuba okuphezulu kobushushu, kunye nokusebenza kakuhle koomatshini kunokuphuculwa ngobunjineli obuchanekileyo ukuze kuhlangatyezwane nemigangatho ye-semiconductor grade, ingakumbi xa yenziwe kwiiplate ze-aluminium ezenziwe ngokwezifiso, iibha ze-aluminium, kunye neetyhubhu ze-aluminium. Impumelelo ephambili yeza kwiindlela eziphambili zoomatshini ezilungiselelwe iimpawu ezikhethekileyo ze-aluminium, ezivumela abavelisi ukuba benze izinto ezijongana neendawo ezithile zentlungu kwimisebenzi yokucoca umgca. Umatshini wokulungisa we-CNC, odityaniswe novavanyo lwe-ultra-sonic kunye nolawulo oluqinileyo lomgangatho, wenze ukuba i-aluminium ihlangabezane neemfuno ezingqongqo kakhulu zoshishino zokuchaneka kobukhulu kunye nokugqitywa komphezulu, okwenza iinkonzo zethu zoomatshini be-aluminium zibe liqabane elibalulekileyo kubenzi bezixhobo ze-semiconductor.

Enye yezona ndlela zibalulekileyo zokusetyenziswa kwe-aluminium kwimigca yokucoca kukwiigumbi ze-vacuum plasma, apho ukuvuleka kwemagnethi kwezinto ezisetyenzisiweyo kuthintela ukugqwetheka kweendawo ze-plasma ze-RF, into ebalulekileyo ekufezekiseni ukugqwethwa kunye nokucoca okufanayo. Ngokungafaniyo nentsimbi engagqwaliyo, enokuphazamisanaukusasazwa kweplasma, ipleyiti yealuminiyamIindonga zegumbi ziqinisekisa uxinano lweplasma oluhambelanayo kumphezulu we-wafer, zinciphisa ukuguquguquka kwenkqubo kwaye ziphucula isivuno. Izakhiwo zenkxaso yebha ye-aluminium echanekileyo, ezenzelwe ukumelana noxinzelelo lwe-UHV, zibonelela ngokuthembeka kwesakhiwo ngaphandle kokongeza ubunzima obugqithisileyo. Ukongeza, ii-feedthroughs ze-vacuum tube ye-aluminium engenamthungo, ezenziwe ngomatshini ukuya kwi-±0.003mm tolerances, zigcina ukuthembeka kwe-UHV ngelixa zivumela ukudlula kweegesi zenkqubo kunye nemiqondiso yombane. Ezi zixhobo ze-aluminium, ezenziwe nge-6061-T6 alloy ene-CNC engenamthungo machining, zifezekisa ukusebenza kwe-UHV ngamazinga okuvuza kwe-helium angaphantsi kwe-10⁻⁹ mbar·L/s, zihlangabezana nemigangatho engqongqo ye-vacuum kwiinkqubo ze-semiconductor eziphambili. Iindawo ze-aluminium ezifakwe i-anodized ziphucula ukusebenza ngokubonelela ngomqobo oqinileyo, omelana nokugqwala omelana nokuvezwa ixesha elide kwiintlobo ze-plasma ezisebenzayo ezifana ne-oxygen kunye ne-fluorine.

Kwiinkqubo zebhentshi ezimanzi, izinto ze-aluminium zibonakalise ixabiso lazo kwii-manifolds zokuhambisa ulwelo, ii-wafer carriers, kunye neetanki zokuhlamba, kunye neetyhubhu ze-aluminium, iiplate ze-aluminium, kunye neebha ze-aluminium ezenza umqolo wezi nkqubo zichaneke kakhulu. Iityhubhu ze-aluminium ezicwangcisiweyo (3mm ~ 200mm ububanzi) ezineetshaneli ze-micro-orifice ziqinisekisa amazinga okuhamba kweekhemikhali achanekileyo, abalulekileyo ekugcineni iiprofayili zokukrola ezihambelanayo kwii-wafers ze-intshi ezili-12. Ngokungafaniyo nezinto zeplastiki, ezinokukhupha ukungcola okanye zonakale ngokuhamba kwexesha, ii-manifolds zetyhubhu ye-aluminium azinagesi kwaye ziyahambelana nazo zonke iikhemikhali zokucoca eziqhelekileyo, kubandakanya i-50:1 HF kunye nee-etchants ezisekwe kwi-peroxide. Ii-wafer carriers zeplate ye-aluminium, ezenziwe nge-precision slots zokubamba ii-wafers ngokukhuselekileyo ngexesha lokucoca, zibonelela ngenye indlela elula kunentsimbi engagqwaliyo, zinciphisa ukudinwa kwengalo yerobhothi kwaye zivumela amaxesha okujikeleza akhawulezileyo. Ukuqhuba kwazo okuphezulu kobushushu kuqinisekisa ukusasazwa kobushushu obufanayo ngexesha lokucoca, ukunciphisa i-wafer warpage kunye nokuphucula utshintsho lobukhulu obupheleleyo (TTV) ukuya ngaphantsi kwe-5%, i-metric ephambili yokucubungula i-wafer ephucukileyo. Ukongeza, iireli zesikhokelo sebha ye-aluminium, ezidityaniswe kwiinkqubo zothutho lwebhentshi emanzi, zibonelela ngentshukumo egudileyo, engenakuphikiswana kwiinqwelo ze-wafer, zinciphisa ukuveliswa kwamasuntswana kwaye ziphucula ukuthembeka kwenkqubo.

Iingenelo zokusebenza kwe-aluminium zixhaswa yidatha ecacileyo. Uphando lwakutshanje olwenziwe ngumvelisi wezixhobo ze-semiconductor ophambili luthelekise izinto ze-aluminium kunye nentsimbi engagqwaliyo kumgca wokucoca ibhentshi emanzi ephezulu, lugxile kwimpembelelo yeetyhubhu ze-aluminium, iipleyiti ze-aluminium, kunye nomatshini wokuchwetheza ngokuchanekileyo. Iziphumo bezimangalisa: ii-manifolds zetyhubhu ye-aluminium zinciphise ukusetyenziswa kweekhemikhali nge-12% ngenxa yokulawulwa kokuhamba kwamanzi okuphuculweyo, ngelixa ii-carriers ze-wafer zeplate ye-aluminium zinciphise ixesha lokuphatha nge-18% ngenxa yobunzima bazo obulula. Okubaluleke kakhulu, umgca oxhotyiswe nge-aluminium ufumene izinga eliphezulu lesivuno se-6.5% kwii-wafers ze-5nm, eziqhutywa kukuphuculwa kokucoca okufanayo kunye nokunciphisa ungcoliseko lwamasuntswana. Olu phuculo luguqulele ekugcinweni kweendleko zonyaka eziqikelelweyo ezingaphezulu kwe-$2 yezigidi zeerandi kwifektri, i-ROI enomdla yokuphucula i-aluminium.

Enye indawo apho i-aluminium igqwesa khona kulawulo lobushushu, umngeni obalulekileyo kwimigca yokucoca apho iimpendulo zeekhemikhali ze-exothermic kunye neenkqubo ze-plasma zivelisa ubushushu. Ukuqhuba kobushushu kwe-aluminium (≈150 W/m·K) kungaphezulu kokuphindwe kathathu kunentsimbi engagqwaliyo, okuvumela ukuchithwa kobushushu okusebenzayo kunye nolawulo lobushushu. Iipleyiti zokupholisa zepleyiti ye-aluminium ezenziwe ngomatshini ochanekileyo, ezidityaniswe kwiibhafu zebhentshi ezimanzi kunye namagumbi e-plasma, zigcina uzinzo lobushushu ngaphakathi kwe-±0.5°C, ziqinisekisa ukusebenza kokucoca rhoqo nangona kuqhubeka ixesha elide lokuvelisa. Izitshintshi zobushushu zebha ye-aluminium, ezidityaniswe nemigca yokupholisa yetyhubhu ye-aluminium, zidlulisela ubushushu ngokukhawuleza kude nezinto ezibalulekileyo, zithintela ubushushu obugqithisileyo kwaye zandise ubomi bezixhobo. Olu zinzo lobushushu lubaluleke kakhulu kwiinkqubo eziphambili ezifana nokucoca i-RCA, apho ulawulo lobushushu oluchanekileyo lubalulekile ekususeni iintsalela zezinto eziphilayo kunye nongcoliseko lwesinyithi ngaphandle kokonakalisa umphezulu we-wafer.

Ubuchule bokusebenza kwe-aluminium yenye inzuzo ephambili, evumela ukuveliswa kwezinto ezintsonkothileyo, ezenziwe ngokwezifiso eziphucula ukusebenza komgca wokucoca, amandla amiselaiinkonzo zoomatshini be-aluminium ngaphandleNgokungafaniyo nentsimbi engagqwaliyo, efuna izixhobo ezikhethekileyo kunye namaxesha amade okusebenza, i-aluminium inokulungiswa ngokuchanekileyo ibe yimilo entsonkothileyo enokunyamezelana okuqinileyo (± 0.005mm) ngexabiso eliphantsi. Oku kuguquguquka kuvumela abavelisi bezixhobo ukuba bayile imigca yokucoca ethambileyo, esebenza kakuhle, kwaye ilungiselelwe iimfuno ezithile zenkqubo. Umzekelo, iiprofayili zebha ze-aluminium ezikhutshwe ngokuchanekileyo zisetyenziswa kwizakhelo zokucoca kunye neendawo ezivalekileyo, zibonelela ngokuqina kwesakhiwo ngelixa zinciphisa ubunzima bezixhobo ngokubanzi ukuya kuthi ga kwi-30%. Oku akunciphisi nje kuphela iindleko zokufakela kodwa kwenza kube lula ukuphinda ulungiselele imigca yenkqubo entsha, amandla abalulekileyo kushishino apho ubuchwepheshe butshintsha ngokukhawuleza. Ukongeza, iipleyiti ze-aluminium ziyabhidliza, zenziwe ngeepateni zemingxuma ezenziwe ngokwezifiso, ziphucula ukuhamba kwegesi kumagumbi e-plasma, ziphucula ngakumbi ukulingana kokucoca.

Iingenelo zokuzinza kwe-aluminium ziqinisa ngakumbi imeko yayo kwimveliso ye-semiconductor, apho uxanduva lokusingqongileyo luba yinto ebaluleke ngakumbi. I-aluminium inokuphinda isetyenziswe nge-100% ngaphandle kokulahlekelwa ngumgangatho, nto leyo enciphisa umngcipheko wekhabhoni wepleyiti ye-aluminium, i-aluminium bar, kunye neenxalenye zetyhubhu ye-aluminium. Iimfuno zayo zamandla aphantsi zoomatshini kunye nokuthutha nazo zinegalelo kwimisebenzi eluhlaza, zihambelana nenjongo yoshishino yokunciphisa impembelelo yokusingqongileyo. Kwabo bafuna ukuhlangabezana neenjongo zokuzinza ngelixa begcina ukusebenza, i-aluminium inika ithuba elicacileyo ngaphezu kwezinto zemveli.

Njengoko iinkqubo ze-semiconductor zisiya kwi-2nm nangaphezulu, iimfuno kwimigca yokucoca ziya kwanda kuphela kwaye i-aluminium ikwimeko entle yokujongana nale mingeni. Utshintsho oluqhubekayo kuphuhliso lwe-aluminium alloy, njengokungeniswa kwe-5083 kunye ne-7075 alloys ecocekileyo, luphucula amandla ezinto kunye nokumelana nokugqwala, lwandisa ukusetyenziswa kwazo nakwiinkqubo zokucoca ezifuna kakhulu. Iindlela eziphambili zoomatshini, kubandakanya umatshini we-laser kunye nomatshini wokukhupha umbane (EDM), zityhala imida yoko kunokwenzeka nge-aluminium, zivumela izixhobo ezinokunyamezelana okuqinileyo kunye nejometri ezintsonkothileyo.

Ukusuka kwindlela engaqwalaselwanga kakuhle ukuya kwinxalenye engabalulekanga, ukunyuka kwe-aluminium kwimigca yokucoca ye-semiconductor bubungqina bamandla obunjineli obuchanekileyo kunye nesayensi yezinto eziphathekayo. Ngokusebenzisa amandla e-aluminium kunye nokuphucula ngokusebenzisa ubuchwephesha obuphezulu beepleyiti ze-aluminium, iibha ze-aluminium, kunye neetyhubhu ze-aluminium, ishishini le-semiconductor lifumene izinto ezibonelela ngokusebenza okuphezulu, iindleko eziphantsi, kunye nokuzinza okukhulu, zonke izinto ezibalulekileyo kwimarike ekhuphisana kakhulu. Njengoko izinto ezininzi ezisemgangathweni ziqonda iingenelo ze-aluminium, indima yayo kwimigca yokucoca iya kuqhubeka ikhula, iqhuba ubuchule kwaye ivumela isizukulwana esilandelayo.ulungiseleloofiteknoloji ye-semiconductor. Ikamva lokucoca i-semiconductor lilula, lichanekile, kwaye lisebenza kakuhle, kwaye lakhiwe kwi-aluminium.