Cov chav nqus tsev semiconductor ua haujlwm ua cov khoom siv kaw tseem ceeb rau kev etching, PVD deposition thiab ion implantation cov txheej txheem, kev xaiv cov hlau tsis raug ua rau muaj kev tawm ntau dhau, kev hloov pauv ntawm cov qauv lossis kev xau ntawm lub tshuab nqus tsev, ua rau cov wafer tsim tawm qis dua. Ob qho tib si 5052 H32 thiab 5083 H321 koom nrog Al-Mg uas tsis kho tau kub.cov qib wrought aluminium,txawm li cas los xij, cov khoom sib txawv ntawm magnesium thiab manganese faib lawv cov xwm txheej semiconductor cavity uas siv tau yooj yim.

Kev siv tshuaj lom neeg ua rau muaj kev ua tau zoo. 5052 muaj 2.2~2.8 wt% Mg nrog rau cov khoom Mn tsawg dua 0.1%, thaum 5083 txhim kho cov ntsiab lus Mg mus rau 4.0~4.9% ntxiv rau 0.4~1.0% manganese rau kev ua kom cov noob zoo thiab ua kom cov khoom khov kho. Qhov sib txawv ntawm cov khoom no muab 38~42% siab dua qhov kawg tensile zog ntawm 5083 (310~320MPa vs 215~230MPa ntawm 5052), tsim lawv thawj daim ntawv thov watershed rau kev tsim vaj tsev semiconductor.

5052 tswj hwm cov chav hloov pauv me me, cov qauv nyuaj thiab cov qhov rooj me me hauv cov khoom siv semiconductor nruab nrab. Nws qhov kev ua kom txias zoo dua thiab kev ua kom yooj yim rau ntau-axis CNC lub hnab tshos sib sib zog nqus, kev sib tsoo txias thiab kev sib xyaw ua ke flange nyias yam tsis muaj kev hloov pauv springback. Cov hlau no muaj kev tswj hwm qis outgassing tus nqi qis dua 10⁻⁸ Torr·L/(s·cm²) tom qab kev siv hluav taws xob precision, phim cov qauv kaw ultra siab (UHV) rau cov kab me me. Kev siv nyiaj zoo yog lwm qhov tseem ceeb: kev siv nyiaj ntawm cov khoom siv raw ntawm 5052 txiav 12 ~ 15% piv rau 5083, zoo tagnrho rau OEM pawg tsim cov qauv semiconductor peripheral casings thiab cov qhov rooj sensor mounting. Peb lub Hoobkas paub txog kev ua kom tiav cov khoom loj thiabKev ua tiav ntawm 5052 daim ntawv, cov tuav khoom khov kho thiab cov raj txhuas tsis muaj qhov sib txuas nrog ± 0.003 hli qhov ntev ntawm kev kam rau siab ntawm tsib-axis CNC machining chaw.

Hloov mus rau cov chav ua haujlwm loj uas ua haujlwm hnyav, thiab 5083 yuav tsis muaj qhov hloov pauv tau. Nws lub zog kho tshuab siab tiv taus kev hloov pauv ntawm lub tshuab nqus tsev thiab rov ua dua thermal cycling creep nyob rau hauv qhov kub siab-qis hloov pauv hauv cov qhov tso zis. H321 tempered 5083 muaj qhov ua kom zoo tshaj plaws kev ntxhov siab corrosion cracking (SCC) tiv thaiv halogen-based corrosive process gas, tseem ceeb rau cov khoom siv etch siab heev uas raug rau fluorine uas muaj plasma atmospheric. Superior cryogenic toughness ntxiv rau qhov kub qis semiconductor process chambers khiav ntawm sub zero operational ib puag ncig, zam kev tawg brittle failure nyob rau hauv thermal shock.

Peb lub zog tsim khoom hauv tsev txhawb nqa kev ua haujlwm tshwj xeeb rau ob qho tib si alloys. Nruab nrog Chav Kawm 10,000 lub chaw ua haujlwm huv si, helium mass spectrometer leak detector thiab automatic ultrasonic cleaning kab, peb ua tiav ib qho kev pabcuam ib-nres los ntawm kev txiav aluminium slab, precision CNC machining, inert-gas TIG vuam mus rau ultra fine surface finishing rau semiconductor cavity Cheebtsam. Cov zis txhua hli ntaus ntau dua 35 tons ntawm cov khoom tiav 5052/5083 machined, npog cov phaj txhuas kev cai, khoom txhuas bar thiab hollow txhuas raj raw khoom muab nrog rau cov khoom tiav chamber fabrication.

Rau cov neeg siv khoom uas tsis meej pem txog kev xaiv qib:xaiv 5052 rau qhov sib dua, cov qhov me me uas nyuaj rau tus nqi. Xaiv 5083 rau cov chav loj, thauj khoom ntau, thiab cov chav ua haujlwm hauv qhov chaw corrosive. Peb pab neeg engineering muab kev sim ua qauv FEA dawb thiab kev sab laj xaiv cov khoom siv los ua kom koj cov peev nyiaj yuav khoom semiconductor enclosure zoo tshaj plaws thiab kev ruaj khov ntawm cov khoom siv mus sij hawm ntev.