Iigumbi zokucoca i-semiconductor zisebenza njengezithuthi ezivaliweyo eziphambili zokugrumba, ukufakwa kwe-PVD kunye neenkqubo zokufakelwa kwee-ion, ukukhethwa okungafanelekanga kwe-alloy kubangela ukuphuma kwegesi ephezulu, ukuphambuka kwesakhiwo okanye ukuvuza kwe-vacuum, okunciphisa ngokuthe ngqo isivuno semveliso ye-wafer. Zombini i-5052 H32 kunye ne-5083 H321 zeze-Al-Mg ezinganyangekiyo ngobushushu.amanqanaba e-aluminium eyenziweyo,kodwa ukwakheka kwe-magnesium kunye ne-manganese okwahlukeneyo kwahlulahlula iimeko zazo ze-semiconductor cavity ezifanelekileyo ngokusisiseko.

Ikhemistri ibeka umda wokusebenza. I-5052 iqulethe i-2.2 ~ 2.8 wt% Mg kunye ne-Mn element engaphantsi kwe-0.1%, ngelixa i-5083 iphucula umxholo we-Mg ukuya kwi-4.0 ~ 4.9% kunye ne-0.4 ~ 1.0% manganese yokucoca iinkozo kunye nokuqinisa isisombululo esiqinileyo. Lo msantsa wokwakheka unika amandla aphezulu angama-38 ~ 42% kwi-5083 (310 ~ 320MPa vs 215 ~ 230MPa ye-5052), okwenza isicelo sayo sokuqala sokucwangcisa izindlu ze-semiconductor.

I-5052 ilawula amagumbi okudlulisa aqinileyo, antsonkothileyo kunye neendawo ezincinci zokuvala umthwalo kwizixhobo ze-semiconductor eziphakathi. Ukwakheka kwayo okubandayo okuphezulu kunye nokuguquguquka kwenza kube lula ukusebenza kwe-multi-axis CNC deep pocket machining, ukucola okuntsonkothileyo kunye nokwakheka kwe-flange encinci ngaphandle kokuguqulwa kwe-springback. I-alloy inezinga eliphantsi lokukhupha igesi elingaphantsi kwe-10⁻⁸ Torr·L/(s·cm²) emva kokupholisha ngombane ngokuchanekileyo, ihambelana nemigangatho yokutywina ye-ultra high high vacuum (UHV) yenkqubo ye-batch small volume process cavities. Ukusebenza kakuhle kweendleko yenye into ebalulekileyo: iindleko zezinto eziluhlaza ze-5052 cuts 12~15% xa kuthelekiswa ne-5083, ifanelekile kwii-OEM mass created standard semiconductor peripheral casings kunye ne-assistive sensor mounting cavities. Umzi-mveliso wethu uqaphela i-high-volume blanking kunyeukugqiba ukuchwetheza amaphepha angama-5052, iibha eziqinileyo kunye neetyhubhu ze-aluminiyam ezingenamthungo ezinokunyamezelana okulinganayo kwe-±0.003mm ngokusebenzisa iziko zoomatshini be-CNC ezine-axis ezintlanu.

Ukutshintshela kwiigumbi zenkqubo ezisebenza nzima, kwaye i-5083 ayithatyathelwa indawo. Ukuqina kwayo okuphezulu koomatshini kuyamelana nokuguquguquka koxinzelelo lwe-vacuum olujikelezayo kunye nokuqhekeka okuphindaphindiweyo kokujikeleza kobushushu phantsi kweemeko zokusebenza ezitshintshana ngobushushu obuphantsi ngaphakathi kwemigodi yokubeka. I-H321 tempered 5083 ine-optimized stress corrosion cracking (SCC) ukumelana negesi yenkqubo ye-corrosive esekelwe kwi-halogen, ibaluleke kakhulu kwizixhobo ze-etch eziphambili ezivezwe emoyeni we-plasma oqulethe i-fluorine. Ukuqina okuphezulu kwe-cryogenic kuhambelana ngakumbi neegumbi zenkqubo ye-semiconductor yobushushu obuphantsi ezisebenza kwindawo yokusebenza engaphantsi kwe-zero, ziphepha ukungaphumeleli kwe-brittle crack phantsi koxinzelelo lobushushu.

Amandla ethu emveliso angaphakathi axhasa umatshini wokulungisa owenziwe ngokwezifiso kuzo zombini ii-alloys. Sixhotyiswe nge-Class 10,000 clean workshop, i-helium mass spectrometer leak detector kunye nomgca wokucoca we-ultrasonic ozenzekelayo, senza inkonzo yokumisa enye ukusuka ekusikeni i-aluminium slab, i-precision CNC machining, i-inert-gas TIG welding ukuya ekugqityweni komphezulu ocolekileyo kakhulu wezinto ze-semiconductor cavity. Imveliso yenyanga ifikelela kwiitoni ezingama-35 zezixhobo ezigqityiweyo ze-5052/5083 ezenziwe ngomatshini, ezigubungela ipleyiti ye-aluminium eyenzelwe wena, i-solid aluminium bar kunye ne-hollow aluminium tube raw stock supply kunye nokuveliswa kwegumbi eligqityiweyo.

Kwabathengi abadidekileyo malunga nokukhetha amanqaku:khetha i-5052 ukuze ufumane ukukhanya okukhaphukhaphu, imingxunya emincinci entsonkothileyo evakalelwa yindleko. Khetha i-5083 ukuze ufumane amagumbi amakhulu, umthwalo omninzi, kunye nenkqubo yokusingqongileyo erhabaxa. Iqela lethu lobunjineli libonelela ngokulinganisa ulwakhiwo lwe-FEA simahla kunye nokubonisana ngokukhetha izinto ukuze kuphuculwe uhlahlo-lwabiwo mali lwakho lokuthenga i-semiconductor enclosure kunye nokuzinza kwezixhobo ixesha elide.