Makamuri ekuputira eSemiconductor anoshanda senzira dzekutakura dzakavharirwa dzekucheka, kuisa maPVD uye kuisa maion, kusarudzwa kwealloy kusina kunaka kunokonzera kubuda kwegasi zvakanyanya, kutsauka kwechimiro kana kubuda kwevacuum, zvichideredza zvakananga goho rekugadzira wafer. Dzese 5052 H32 ne5083 H321 ndedzeAl-Mg isingarapike nekupisa.magiredhi ealuminium akagadzirwa,asi mhando dzakasiyana dze magnesium ne manganese dzinoparadzanisa mamiriro avo e semiconductor cavity zvakanyanya.

Kemistri inoisa muganhu wekushanda. 5052 ine 2.2~2.8 wt% Mg ine marginal Mn element iri pasi pe0.1%, ukuwo 5083 inovandudza Mg kusvika pa4.0~4.9% pamwe ne 0.4~1.0% manganese yekunatsiridza zviyo uye kusimbisa solid-solution. Iyi compositional gap inopa 38~42% yepamusoro simba rekudhonza pa5083 (310~320MPa vs 215~230MPa ye5052), zvichiita kuti ive nzvimbo yavo yekutanga yekushandisa kugadzira semiconductor housing design.

5052 inotonga makamuri ekuchinjisa akamanikana, akaomarara uye madiki anovhara mutoro mumidziyo ye semiconductor yepakati. Kugona kwayo kutonhora kwakanyanya uye ductility inorerutsa multi-axis CNC deep pocket machining, yakaoma kutonhora channel milling uye thin flange integrated forming isina springback deformation. Chiumbwa ichi chine mwero wakaderera we outgassing pasi pe10⁻⁸ Torr·L/(s·cm²) mushure mekunyatso gadzira magetsi, ichienzanisa ultra high high vacuum (UHV) basic sealing standards ye batch type small volume process cavities. Kushanda zvakanaka kwemutengo chimwe chinhu chinokosha: kushandiswa kwezvinhu zvisina kugadzirwa kwe5052 cuts 12~15% zvichienzaniswa ne5083, kwakanakira OEM mass yakagadzirwa semiconductor peripheral casings uye assistant sensor mounting cavities. Fekitori yedu inoita blanking yakawanda uyekupedzisa kugadzira machira e5052, simbi dzakasimba uye machubhu earuminiyamu asina musono ane ±0.003mm divi rimwe chete rekutsungirira kuburikidza nenzvimbo dzekugadzira dzeCNC dzine axis five.

Kuchinjwa kuenda kumakamuri makuru ekushanda anorema, uye 5083 inova isingatsiviwi. Kusimba kwayo kwakanyanya kwemuchina kunodzivirira kushanduka kwevacuum differential pressure deformation uye kudzokorora thermal cycling creep pasi pemamiriro ekushanda anochinja-chinja tembiricha yakadzika mukati menzvimbo dzekuisa zvinhu. H321 tempered 5083 ine optimized stress corrosion cracking (SCC) resistance kubva ku halogen-based corrosive process gas, yakakosha kune michina yepamusoro ye etch yakavhenekerwa nemhepo ine fluorine ine plasma. Kusimba kwakanyanya kwe cryogenic kunoenderana nemakamuri e semiconductor process ekushanda ari pasi pe zero, kudzivirira brittle crack failure pasi pe thermal shock.

Simba redu rekugadzira zvinhu rinotsigira mashandiro akagadzirwa emhando dzese dze alloys. Tine Class 10,000 clean workshop, helium mass spectrometer leak detector uye otomatiki ultrasonic cleaning line, tinoshanda pamwe chete kubva pakucheka aruminiyamu, kugadzira aruminiyamu ne precision CNC, TIG welding kusvika pakupera kwepamusoro-soro kwezvikamu zve semiconductor cavity. Kubuda kwemwedzi kunosvika matani anopfuura makumi matatu nemashanu ezvikamu zve5052/5083 zvakagadzirwa ne machine, zvichifukidza custom aruminiyamu plate, solid aruminiyamu bar uye hollow aruminiyamu tube raw stock supply pamwe chete nekugadzirwa kwekamuri.

Kune vatengi vakavhiringidzika nezvekusarudza mamakisi:sarudza 5052 yehuremu hwakareruka, makomba madiki akaomarara anonzwa mutengo. Sarudza 5083 yemakamuri makuru, anorema zvakanyanya, uye anoparadza nharaunda. Chikwata chedu cheinjiniya chinopa kubvunzana kweFEA structure simulation uye kusarudza zvinhu kuti uvandudze bhajeti rako rekutenga semiconductor enclosure uye kugadzikana kwemidziyo kwenguva refu.